Welcon Inc.


Contact person: Kiyohiko Matsubara
Correspondence: English
Foundation: 2006
Operation Level: National

Address: (15-1 Akihaku Yashiroda)
956-0113 Niigata Japan
Phone: +81250381 900
Fax: +81250 381 901
Web: http://www.welcon.co.jp


WELCON Inc. applies diffusion bonding technology and has achieved high quality solutions, such as high efficiency, down sizing, energy saving, multi function, higher pressure resistance and so on. We encourage exploration of innovation based on research, analysis and evaluation. Challenging requests from customers in all fields, we are committed to satisfy them and enjoy creation. Our goal is to be the vanguard of technological creation so that every customer can depend on us.

Business Outline

Provide mass-production 3D hollow structure component by diffusion bonding that machining cannot achieve.

Proceed energy saving / small footprint, using microchannel by diffusion bonding and supply high-inner pressure, high-density and High-performance thermal components.

Differentiate using in-house design diffusion bonding equipment and process engineering R&D feedback with material technology and structural design. And create original special application components.

Heat control & diffusion bonding related products, developing & manufacturing such as heat exchanger, heat sink, etc.

HANNOVER MESSE
International trade fair of factory automation, materials handling and logistics, surface and subcontracting technologies
01/04/2019 - 05/04/2019
Location Deutsche Messe
Hannover
Germany
FC EXPO
International hydrogen and fuel cell exhibition
26/02/2020 - 28/02/2020
Location Tokyo Big Sight
Tokyo
Japan
TECHNO-FRONTIER
Electronic and Mechatronic Parts Exhibition
17/04/2019 - 19/04/2019
Location Makuhari Messe - Nippon Convention Center
Chiba
Japan
SEMICON JAPAN
International exhibition for equipment and materials
12/12/2018 - 14/12/2018
Location Makuhari Messe
Chiba
Japan